| CPC H01L 27/1222 (2013.01) [H01L 27/1288 (2013.01)] | 6 Claims |

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1. An array base plate, comprising:
a substrate;
an active layer disposed on the substrate;
an etching protective layer and an ohmic contact layer, wherein the etching protective layer and the ohmic contact layer are disposed in a same layer, the etching protective layer is located on a body portion of the active layer, and the ohmic contact layer is located on a first conduction portion and a second conduction portion of the active layer;
a source disposed on the ohmic contact layer located on the first conduction portion of the active layer; and
a drain disposed on the ohmic contact layer located on the second conduction portion of the active layer;
wherein a material of the ohmic contact layer comprises a metal or metal oxide, and a material of the etching protective layer comprises an Si-based insulating material.
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