| CPC H01L 25/167 (2013.01) [H01L 25/0753 (2013.01); H01L 33/0095 (2013.01); H01L 33/483 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/32 (2013.01); H01L 33/44 (2013.01); H01L 33/54 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01)] | 15 Claims |

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1. A method for manufacturing micro-LED displays, comprising:
depositing a first material over a substrate having a plurality of micro-LEDs that emit light in a first wavelength range such that the plurality of micro-LEDs are covered by the first material and the first material fills gaps laterally separating the micro-LEDs;
removing a portion of the first material from the gaps that laterally separate the plurality of micro-LEDs to form trenches in the first material that extend to or below light-emitting layers of the micro-LEDs;
depositing a second material over the substrate such that the second material covers the first material and extends into the trenches in the first material;
removing a portion of the first and second materials over the plurality of micro-LEDs to form wells over each the plurality of micro-LEDs and such that a plurality of walls of the second material positioned in the gaps between the plurality of micro-LEDs extend vertically higher than a top surface of the first material;
depositing a third material that conformally coats bottoms of the wells and surfaces of the walls of the second material to form isolation walls between the plurality of micro-LEDs, wherein the third material has higher opacity than the second material and has transmittance less than 1% of light in the first wavelength range; and
removing a portion of the third material over the micro-LEDs at the bottoms of the wells.
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