US 12,224,271 B2
Integrating control circuits with light emissive circuits with dissimilar wafer sizes
Rajendra D. Pendse, Fremont, CA (US)
Assigned to Meta Platforms Technologies, LLC, Menlo Park, CA (US)
Filed by Meta Platforms Technologies, LLC, Menlo Park, CA (US)
Filed on Mar. 5, 2021, as Appl. No. 17/193,871.
Claims priority of provisional application 63/043,898, filed on Jun. 25, 2020.
Claims priority of provisional application 63/021,441, filed on May 7, 2020.
Claims priority of provisional application 62/987,744, filed on Mar. 10, 2020.
Prior Publication US 2021/0288036 A1, Sep. 16, 2021
Int. Cl. H01L 27/15 (2006.01); G06F 1/16 (2006.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 29/26 (2006.01); H01L 31/12 (2006.01); H01L 33/00 (2010.01); H01L 33/52 (2010.01); H01L 33/62 (2010.01); G02B 27/01 (2006.01)
CPC H01L 25/167 (2013.01) [G06F 1/163 (2013.01); H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 33/0062 (2013.01); H01L 33/0095 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); G02B 27/0172 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An article comprising:
a first semiconductor including at least one integrated circuit;
a first μLED array on a first surface of the first semiconductor;
a fill material disposed on a first edge of the first semiconductor and extending in a direction substantially perpendicular to the first surface of the first semiconductor to be also disposed on a first edge of the first μLED array, wherein the first edge of the first μLED array and the first edge of the first semiconductor are substantially co-planar and are oriented substantially perpendicularly to the first surface of the first semiconductor; and
a second semiconductor including at least one integrated circuit, wherein the fill material joins the first and second semiconductors.