US 12,224,263 B2
Method for transferring electronic device
Yu-Min Huang, Taoyuan (TW); Sheng Che Huang, Taoyuan (TW); Chingju Lin, Taoyuan (TW); and Wei-Hao Wang, Taoyuan (TW)
Assigned to Micraft System Plus Co., Ltd., Taoyuan (TW)
Filed by Micraft System Plus Co., Ltd., Taoyuan (TW)
Filed on Mar. 5, 2024, as Appl. No. 18/595,443.
Application 18/595,443 is a continuation of application No. 17/577,406, filed on Jan. 18, 2022, granted, now 11,973,054.
Claims priority of provisional application 63/185,328, filed on May 6, 2021.
Claims priority of application No. 110127169 (TW), filed on Jul. 23, 2021.
Prior Publication US 2024/0213209 A1, Jun. 27, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. B23K 1/00 (2006.01); B23K 1/005 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01)
CPC H01L 24/75 (2013.01) [B23K 1/0053 (2013.01); B23K 1/0056 (2013.01); H01L 24/80 (2013.01); H01L 24/81 (2013.01); B23K 2101/40 (2018.08); H01L 2224/75263 (2013.01); H01L 2224/75283 (2013.01); H01L 2224/75705 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/80224 (2013.01); H01L 2224/8023 (2013.01); H01L 2224/80815 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/8123 (2013.01); H01L 2224/81815 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method for transferring an electronic device, comprising:
providing a flexible carrier having a first surface on which the electronic device to be transferred is disposed and a second surface which is opposite to the first surface;
providing a target substrate;
providing a pin which is light-transmissible and has a pressing end;
arranging the flexible carrier and the target substrate in a way that the flexible carrier is spaced from the target substrate with the first surface thereof facing the target substrate;
deforming the flexible carrier by exerting the pin to press the second surface of the flexible carrier with the pressing end thereof at a position corresponding to the electronic device disposed on the first surface of the flexible carrier until the electronic device is in contact with the target substrate;
applying an energy beam which is emitted from a light source standing outside the pin and then travels through the pin and goes out from the pressing end of the pin to bond the electronic device onto the target substrate; and
releasing the pin from pressing the flexible carrier.