US 12,224,259 B2
Clamped semiconductor wafers and semiconductor devices
Kirubakaran Periyannan, Santa Clara, CA (US); Daniel Linnen, Naperville, IL (US); and Jayavel Pachamuthu, San Jose, CA (US)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by WESTERN DIGITAL TECHNOLOGIES, INC., San Jose, CA (US)
Filed on Apr. 11, 2022, as Appl. No. 17/718,021.
Prior Publication US 2023/0326887 A1, Oct. 12, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/06 (2013.01) [H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 25/0657 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/06517 (2013.01); H01L 2224/0807 (2013.01); H01L 2224/08147 (2013.01); H01L 2224/80345 (2013.01)] 19 Claims
OG exemplary drawing
 
15. A semiconductor device, comprising:
a signal carrier medium comprising first and second opposed major surfaces, the first surface defining a first direction parallel to the first surface, and a second direction between the first and second opposed major surfaces; and
a set of one or more reservoirs formed in the signal carrier medium and open to at one of the first and second major surfaces, the set of one or more reservoirs configured to receive a flowable metal to clamp the semiconductor device to a second semiconductor device upon hardening of the flowable metal in the set of one or more reservoirs, a reservoir of the set of one or more reservoirs comprising:
a first section having a first sub-section extending in the first direction, and a second sub-section extending in the second direction, and
a second section having a third sub-section extending in the first direction and a fourth sub-section extending in the second direction,
wherein the first and second sections are connected to each other through one or more additional sections formed in the second semiconductor wafer.