US 12,224,255 B2
Electronic package including lead frame having multiple conductive posts
Chih-Hsien Chiu, Taichung (TW); and Wen-Jung Tsai, Taichung (TW)
Assigned to Siliconware Precision Industries Co., Ltd., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Mar. 18, 2024, as Appl. No. 18/607,815.
Application 17/518,146 is a division of application No. 16/878,250, filed on May 19, 2020, granted, now 11,195,808, issued on Dec. 7, 2021.
Application 18/607,815 is a continuation of application No. 18/103,196, filed on Jan. 30, 2023, granted, now 11,973,043.
Application 18/103,196 is a continuation of application No. 17/518,146, filed on Nov. 3, 2021, granted, now 11,594,501, issued on Feb. 28, 2023.
Claims priority of application No. 109111986 (TW), filed on Apr. 9, 2020.
Prior Publication US 2024/0321784 A1, Sep. 26, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/49 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01); H01L 23/49861 (2013.01); H01L 23/552 (2013.01); H01L 23/49833 (2013.01); H01L 24/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/3025 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method for fabricating an electronic package, comprising:
providing a carrier structure having an antenna function;
disposing and electrically connecting at least one electronic element and at least one lead frame onto the carrier structure, wherein the at least one lead frame has a plurality of conductive posts separated from one another; and
forming an encapsulant on the carrier structure for encapsulating the at least one electronic element and the at least one lead frame, wherein the encapsulant is defined with a first encapsulating portion and a second encapsulating portion that are integrally formed with one another, wherein the at least one electronic element is positioned in the first encapsulating portion and the plurality of conductive posts are positioned in the second encapsulating portion, wherein a height of the first encapsulating portion is greater than a height of the second encapsulating portion, and wherein end surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion to electrically connect to a connector, and
wherein the at least one lead frame further has at least one conductive wall embedded in the encapsulant, and wherein the at least one conductive wall is separated from the plurality of conductive posts and exposed from the second encapsulating portion.