US 12,224,254 B2
Millimeter-wave antenna chip and terminal device
Weixi Zhou, Shanghai (CN); Liangsheng Liu, Shenzhen (CN); and Guowen Liu, Shanghai (CN)
Assigned to Huawei Technologies Co., Ltd., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
Filed on Jun. 30, 2022, as Appl. No. 17/855,358.
Application 17/855,358 is a continuation of application No. PCT/CN2019/130810, filed on Dec. 31, 2019.
Prior Publication US 2022/0336387 A1, Oct. 20, 2022
Int. Cl. H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 1/42 (2006.01); H01Q 21/06 (2006.01)
CPC H01L 23/66 (2013.01) [H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 1/422 (2013.01); H01Q 21/067 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A millimeter-wave antenna chip, comprising:
a package substrate, at least one subunit, and a radio frequency chip, wherein:
each subunit comprises an end-fire antenna and a metalized fence, and the end-fire antenna is disposed on an upper surface of the package substrate;
the end-fire antenna is electrically connected to the radio frequency chip through a feed line, and the feed line is located between the metalized fence and the end-fire antenna; and
the radio frequency chip is located on a lower surface of the package substrate.