US 12,224,252 B2
Magnetic core inductors in interposer
Krishna Bharath, Phoenix, AZ (US); William J. Lambert, Tempe, AZ (US); Haifa Hariri, Phoenix, AZ (US); Siddharth Kulasekaran, Chandler, AZ (US); Mathew Manusharow, Phoenix, AZ (US); and Anne Augustine, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 23, 2020, as Appl. No. 17/030,121.
Prior Publication US 2022/0093536 A1, Mar. 24, 2022
Int. Cl. H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01)
CPC H01L 23/645 (2013.01) [H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/3025 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A coreless interposer, comprising:
a plurality of buildup layers, wherein electrical routing is provided in the plurality of buildup layers; and
an inductor embedded in the plurality of buildup layers, wherein the inductor comprises:
a plurality of discrete magnetic shells; and
a conductive lining over an interior surface of each of the plurality of discrete magnetic shells.