US 12,224,251 B2
Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads
Ian Harvey Arellano, Bauang (PH)
Assigned to STMicroelectronics, Inc., Calamba (PH)
Filed by STMicroelectronics, Inc., Calamba (PH)
Filed on Dec. 6, 2023, as Appl. No. 18/531,561.
Application 18/531,561 is a division of application No. 17/845,867, filed on Jun. 21, 2022, granted, now 11,862,579.
Application 17/845,867 is a division of application No. 16/996,712, filed on Aug. 18, 2020, granted, now 11,393,774, issued on Jul. 19, 2022.
Claims priority of provisional application 62/889,841, filed on Aug. 21, 2019.
Prior Publication US 2024/0162168 A1, May 16, 2024
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/49513 (2013.01); H01L 23/4952 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A device, comprising:
a package that includes:
a first lead that includes a first internal surface and a second internal surface that is transverse to the first internal surface, the first internal surface including a first plurality of cavities;
a second lead that includes a third internal surface and a fourth internal surface that is transverse to the third internal surface, the first internal surface facing the third internal surface, the third internal surface including a second plurality of cavities,
wherein the first lead includes a fifth internal surface and a sixth internal surface, the fifth internal surface opposite the second internal surface, the sixth internal surface is transverse to the fifth internal surface, ones of the first plurality of cavities in the fifth and sixth internal surfaces; and
an encapsulant on the first, second, third, and fourth internal surfaces, the encapsulant being in the first plurality of cavities on the first internal surface and the second plurality of cavities on the third internal surface of the second lead.