US 12,224,249 B2
Package module comprising marking and shield films and method of manufacturing the same
Toru Komatsu, Nagaokakyo (JP); and Tadashi Nomura, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Oct. 8, 2021, as Appl. No. 17/497,132.
Application 17/497,132 is a continuation of application No. PCT/JP2020/017145, filed on Apr. 21, 2020.
Claims priority of application No. 2019-086251 (JP), filed on Apr. 26, 2019.
Prior Publication US 2022/0028799 A1, Jan. 27, 2022
Int. Cl. H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/544 (2006.01); H01L 25/16 (2023.01)
CPC H01L 23/552 (2013.01) [H01L 21/561 (2013.01); H01L 23/544 (2013.01); H01L 25/16 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A module comprising:
a substrate having a first main surface;
a first component mounted on the first main surface;
a first sealing resin disposed to cover the first main surface and the first component;
a marking film covering at least an upper surface of the first sealing resin and having an upper surface opposite the first sealing resin that comprises a first recess locally disposed therein, and a lower surface adjacent to the upper surface of the first sealing resin that is a completely uniform surface; and
a shield film covering the marking film.