US 12,224,247 B2
Fan-out package having a main die and a dummy die
Yan-Fu Lin, Zhubei (TW); Chen-Hua Yu, Hsinchu (TW); Meng-Tsan Lee, Hsinchu (TW); Wei-Cheng Wu, Hsinchu (TW); and Hsien-Wei Chen, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Mar. 26, 2024, as Appl. No. 18/616,427.
Application 18/616,427 is a continuation of application No. 17/402,734, filed on Aug. 16, 2021, granted, now 11,967,563.
Application 17/402,734 is a continuation of application No. 16/705,308, filed on Dec. 6, 2019, granted, now 11,094,641, issued on Aug. 17, 2021.
Application 16/705,308 is a continuation of application No. 16/227,725, filed on Dec. 20, 2018, granted, now 10,510,674, issued on Dec. 17, 2019.
Application 16/227,725 is a continuation of application No. 15/583,690, filed on May 1, 2017, granted, now 10,163,802, issued on Dec. 25, 2018.
Claims priority of provisional application 62/427,516, filed on Nov. 29, 2016.
Prior Publication US 2024/0266298 A1, Aug. 8, 2024
Int. Cl. H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 23/5286 (2013.01); H01L 24/13 (2013.01); H01L 24/17 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/73 (2013.01); H01L 25/105 (2013.01); H01L 21/486 (2013.01); H01L 23/3128 (2013.01); H01L 23/5384 (2013.01); H01L 23/562 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73101 (2013.01); H01L 2224/73209 (2013.01); H01L 2224/73259 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
placing a functional die and a dummy die on a first substrate, wherein the functional die comprises a first insulating layer overlying the first substrate, wherein the dummy die comprises a second insulating layer overlying a second substrate, wherein the dummy die is free of active devices;
disposing a molding compound along sidewalls of the functional die and the dummy die; and
forming a redistribution structure over the functional die, the dummy die, and the molding compound, wherein forming the redistribution structure comprises forming a first conductive line electrically coupled to the functional die, wherein forming the redistribution structure comprises forming a first external contact on a side opposite the functional die.