| CPC H01L 23/49894 (2013.01) [H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 25/18 (2013.01)] | 12 Claims |
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1. A semiconductor device comprising:
a substrate;
a semiconductor chip provided over the substrate; and
a sealing resin which is provided over the substrate and seals the semiconductor chip,
wherein:
the substrate includes
a wire layer including a wire electrically connected to the semiconductor chip, and
an insulating layer provided in contact with the wire layer and including a glass woven fabric containing a resin,
the glass woven fabric includes a plurality of glass fibers that are provided along two or more directions parallel with the glass woven fabric and are woven,
the glass fibers differ in at least one of a material, a number, and a thickness depending on the directions parallel with the glass woven fabric,
the glass woven fabric includes the glass fibers provided along a first direction and the glass fibers provided along a second direction different from the first direction,
the glass fibers provided along the first direction have a lower coefficient of thermal expansion than the glass fibers provided along the second direction,
a shape of an outer edge of the semiconductor chip as seen in a direction of a normal to a substrate surface of the substrate is substantially rectangular,
the first direction is a direction along long sides of the semiconductor chip,
the second direction is a direction along short sides of the semiconductor chip, and
the resin accounts for a larger part of a cross-sectional area along the short sides than a cross-sectional area along the long sides.
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