US 12,224,235 B2
Printed circuit board
Chan Hoon Ko, Suwon-si (KR); Sang Hoon Kim, Suwon-si (KR); Yoong Oh, Suwon-si (KR); and Hea Sung Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jun. 16, 2023, as Appl. No. 18/211,093.
Application 18/211,093 is a continuation of application No. 17/191,485, filed on Mar. 3, 2021, abandoned.
Claims priority of application No. 10-2020-0170429 (KR), filed on Dec. 8, 2020.
Prior Publication US 2023/0335479 A1, Oct. 19, 2023
Int. Cl. H05K 1/11 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 23/49811 (2013.01); H05K 1/111 (2013.01); H01L 23/49822 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/098 (2013.01); H05K 2201/099 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
a first insulating layer;
a pad disposed in the insulating layer and having a protrusion;
another pad disposed on the insulating layer; and
a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad and of the another pad,
wherein the protrusion protrudes from one surface of the pad and is buried in the insulating layer, and
wherein a top surface of the another pad is higher than a top surface of the pad and lower than a top surface of the protective layer.