| CPC H01L 23/49575 (2013.01) [H01L 23/49517 (2013.01); H01L 23/49562 (2013.01); H01L 24/48 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40175 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01)] | 15 Claims |
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1. A semiconductor module comprising:
a conductive substrate having an obverse surface facing one side in a thickness direction and a reverse surface facing another side opposite from the obverse surface in the thickness direction;
a semiconductor element electrically bonded to the obverse surface and having a switching function;
a conducting member that forms a path of a main circuit current switched by the semiconductor element;
a first input terminal, a second input terminal and a third input terminal that are disposed on one side in a first direction relative to the conductive substrate, the first direction being perpendicular to the thickness direction;
an output terminal disposed on another side in the first direction relative to the conductive substrate; and
a sealing resin covering at least a part of the conductive substrate, the semiconductor element and the conducting member,
wherein the conductive substrate includes a first conductive portion and a second conductive portion,
the semiconductor element includes a first semiconductor element electrically bonded to the first conductive portion and a second semiconductor element electrically bonded to the second conductive portion,
the second input terminal and the third input terminal are disposed on one side and another side in a second direction with the first input terminal disposed therebetween, the second direction being perpendicular to the thickness direction and the first direction,
the first input terminal is one of a positive electrode and a negative electrode and electrically connected to the first conductive portion,
the second input terminal and the third input terminal are each the other of the positive electrode and the negative electrode,
the sealing resin includes a resin side surface facing the one side in the first direction, each of the first input terminal, the second input terminal and the third input terminal protruding from the resin side surface,
the resin side surface is formed with a first recessed portion and a second recessed portion, the first recessed portion being located between the first input terminal and the second input terminal and recessed toward the another side in the first direction, the second recessed portion being located between the first input terminal and the third input terminal and recessed toward the another side in the first direction,
the output terminal is electrically connected to the second conductive portion, and
the conducting member includes a first conducting member connected to the first semiconductor element and the second conductive portion, and a second conducting member connected to the second semiconductor element, the second input terminal and the third input terminal, and the second conducting member is disposed to avoid overlapping with at least a part of the first semiconductor element as viewed in the thickness direction.
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