US 12,224,228 B2
Packaged component with composite pin structure and manufacturing method thereof
Yung-Hui Wang, Kaohsiung (TW); Chung-Hsiung Ho, Kaohsiung (TW); and Chi-Hsueh Li, Tainan (TW)
Assigned to PANJIT INTERNATIONAL INC., Kaohsiung (TW)
Filed by PANJIT INTERNATIONAL INC., Kaohsiung (TW)
Filed on May 11, 2022, as Appl. No. 17/741,872.
Claims priority of application No. 111113406 (TW), filed on Apr. 8, 2022.
Prior Publication US 2023/0326833 A1, Oct. 12, 2023
Int. Cl. H01L 23/49 (2006.01); H01L 21/48 (2006.01)
CPC H01L 23/49 (2013.01) [H01L 21/4889 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A packaged component with a composite pin structure, comprising:
a substrate having a body area and a pin area, wherein the substrate comprises an insulation body and multiple conductive layers, and the body area of the substrate is formed with a chip placement opening;
a chip placed in the chip placement opening;
a protective layer covering the body area to form peripheral surfaces of a packaged component body;
the pin area having multiple pins, extending outward from the packaged component body and electrically connected to the chip, wherein each of the multiple pins has a composite laminated structure, and the composite laminated structure includes:
the insulation body integrally extending from the packaged component body;
the multiple conductive layers, disposed on opposite surfaces of the insulation body of the substrate to electrically connect the chip.