US 12,224,223 B1
Adaptive structure for thermal regulation and optimization
Edward L. Hieb, Plano, TX (US); Nicholas C. Day, Bowling Green, KY (US); and Ken Salas Nobrega, Tucson, AZ (US)
Assigned to Raytheon Company, Arlington, VA (US)
Filed by Raytheon Company, Waltham, MA (US)
Filed on Oct. 12, 2021, as Appl. No. 17/499,040.
Claims priority of provisional application 63/117,326, filed on Nov. 23, 2020.
Int. Cl. H01L 23/367 (2006.01); B22F 10/28 (2021.01); B33Y 10/00 (2015.01); B33Y 40/20 (2020.01); B33Y 80/00 (2015.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01)
CPC H01L 23/3675 (2013.01) [B22F 10/28 (2021.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 80/00 (2014.12); H01L 21/4871 (2013.01); H01L 23/3736 (2013.01); B22F 2301/10 (2013.01); B22F 2301/20 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
an initial structure comprising voids, the initial structure comprising one or more first materials; and
one or more second materials infiltrated into the initial structure, the one or more second materials different from the one or more first materials;
wherein the apparatus is configured to receive and support one or more heat-generating components;
wherein a combination of the first and second materials provides a coefficient of thermal expansion in a portion of the apparatus that substantially matches a coefficient of thermal expansion of the one or more heat-generating components; and
wherein the apparatus is configured to provide a path to remove thermal energy from the one or more heat-generating components.