US 12,224,221 B2
Packaging method and package structure
Chin-Jui Liang, Hsinchu (TW); Hui-Yen Huang, Hsinchu (TW); and Ping-Lung Wang, Hsinchu (TW)
Assigned to HARVATEK CORPORATION, Hsinchu (TW)
Filed by HARVATEK CORPORATION, Hsinchu (TW)
Filed on Jul. 13, 2022, as Appl. No. 17/863,400.
Claims priority of application No. 111115358 (TW), filed on Apr. 22, 2022.
Prior Publication US 2023/0343666 A1, Oct. 26, 2023
Int. Cl. H01L 29/66 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/3135 (2013.01) [H01L 21/566 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/80 (2013.01); H01L 25/0655 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/08258 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/73251 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/8009 (2013.01); H01L 2224/80091 (2013.01); H01L 2224/80097 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80895 (2013.01); H01L 2924/182 (2013.01); H01L 2924/37001 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A packaging method, comprising:
providing a carrying board having a carrying surface;
disposing a plurality of chips on the carrying surface of the carrying board, wherein each of the chips includes a first side connected to the carrying surface and a second side opposite to the first side, and the second side is provided with at least one chip connecting member; and
providing a base structure and integrating the base structure, the chips, and the carrying board into a unitary structure under hot pressing conditions via an encapsulating material;
wherein the base structure has a bonding surface provided with a plurality of predetermined regions for bonding the chips respectively, and each of the predetermined regions has at least one electrically connecting structure formed therein;
wherein the at least one chip connecting member of each of the chips and the at least one electrically connecting structure in the corresponding one of the predetermined regions have a metal-to-metal bond formed therebetween and under the hot pressing conditions, the encapsulating material is formed into an encapsulating layer under the hot pressing conditions, and the encapsulating layer is located between the carrying board and the base structure to isolate the chips from the external environment.