US 12,224,219 B2
Package structure and circuit layer structure including dummy trace and manufacturing method therefor
Wen-Long Lu, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Aug. 29, 2022, as Appl. No. 17/898,299.
Application 17/898,299 is a continuation of application No. 17/092,193, filed on Nov. 6, 2020, granted, now 11,430,708.
Prior Publication US 2022/0415739 A1, Dec. 29, 2022
Int. Cl. H01L 23/31 (2006.01)
CPC H01L 23/3121 (2013.01) [H01L 23/3114 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a wiring structure including a plurality of interconnection traces;
at least one electronic device disposed over the wiring structure, and electrically connected to the plurality of interconnection traces; and
at least one testing trace adjacent to the plurality of interconnection traces,
wherein the wiring structure includes a plurality of circuit layers, wherein the plurality of interconnection traces are disposed at the plurality of circuit layers, and the at least one testing trace is disposed above the plurality of interconnection traces, wherein the at least one electronic device includes two electronic devices; wherein in a top view, a high density region is located between the two electronic devices, and the at least one testing trace is located outside the high density region.