US 12,224,218 B2
Semiconductor packages with increased power handling
Geza Dezsi, Durham, NC (US); Devarajan Balaraman, Apex, NC (US); and Brice McPherson, Fayetteville, AR (US)
Assigned to WOLFSPEED, INC., Durham, NC (US)
Filed by Wolfspeed, Inc., Durham, NC (US)
Filed on Feb. 11, 2022, as Appl. No. 17/670,174.
Prior Publication US 2023/0260861 A1, Aug. 17, 2023
Int. Cl. H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 29/16 (2006.01); H01L 29/78 (2006.01); H01L 29/872 (2006.01)
CPC H01L 23/3107 (2013.01) [H01L 23/3735 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/562 (2013.01); H01L 29/1608 (2013.01); H01L 29/78 (2013.01); H01L 29/872 (2013.01)] 33 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a semiconductor die;
a housing for the semiconductor die, the housing comprising a first material and including a first side, a second side, and a creepage extension structure of the first material that is part of the first side and comprises at least one trench; and
a first lead electrically connected with the semiconductor die, the first lead including a thermal pad and at least one pin that extends away from the thermal pad, the thermal pad comprising a second material that is different from the first material and being arranged at the first side and adjacent to the creepage extension structure.