US 12,224,217 B2
Radio frequency package implementing a window frame with edge plating and processes of implementing the same
Richard Wilson, Morgan Hill, CA (US); Haedong Jang, San Jose, CA (US); Simon Ward, Morgan Hill, CA (US); and Madhu Chidurala, Los Altos, CA (US)
Assigned to MACOM Technology Solutions Holdings, Inc., Lowell, MA (US)
Filed by Cree, Inc., Durham, NC (US)
Filed on Mar. 6, 2020, as Appl. No. 16/811,161.
Prior Publication US 2021/0280478 A1, Sep. 9, 2021
Int. Cl. H01L 23/043 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01)
CPC H01L 23/043 (2013.01) [H01L 21/4817 (2013.01); H01L 21/4846 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A radio frequency (RF) package, comprising:
a support having a semiconductor die attach region;
at least one semiconductor die;
a frame comprising an electrically insulative member having a lower side attached to the support and an upper side opposite the support;
the frame comprising an opening at least partially registered with said semiconductor die attach region;
the frame comprising an upper metallization having a first metallization and a second metallization at the upper side of the electrically insulative member and a lower metallization at the lower side of the electrically insulative member;
at least one discrete device arranged on the upper metallization, the at least one discrete device being configured as a radio frequency component, and the at least one discrete device having terminals connected to the first metallization and the second metallization; and
the frame comprising an electrically conductive edge connection within the opening of the frame connecting the upper metallization to the lower metallization.