US 12,224,200 B2
Substrate treating apparatus
Ji Hoon Jeong, Hwaseong-si (KR); Won-Geun Kim, Goyang-si (KR); Young Dae Chung, Incheon (KR); Jee Young Lee, Suwon-si (KR); and Tae Shin Kim, Suwon-si (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Aug. 5, 2021, as Appl. No. 17/394,868.
Claims priority of application No. 10-2020-0106800 (KR), filed on Aug. 25, 2020.
Prior Publication US 2022/0068698 A1, Mar. 3, 2022
Int. Cl. H01L 21/687 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/68764 (2013.01) [H01L 21/67098 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a support unit configured to support a substrate; and
a heating unit configured to irradiate a beam to the substrate and heat the substrate,
wherein the heating unit further includes:
an irradiation part configured to irradiate the beam; and
a rotation part configured to rotate the beam and including a pair of cylindrical lenses located on a travel path of the beam irradiated by the irradiation part; wherein the pair of cylindrical lenses are configured to be rotatable and rotational directions of the pair of cylindrical lenses are the same;
wherein the support unit and the heating unit are arranged on the same side with respect to the substrate.