US 12,224,199 B2
Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
Takafumi Yamamoto, Fukuoka (JP); and Takuya Nomoto, Fukuoka (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Nov. 4, 2021, as Appl. No. 17/518,727.
Claims priority of application No. 2021-055492 (JP), filed on Mar. 29, 2021.
Prior Publication US 2022/0310437 A1, Sep. 29, 2022
Int. Cl. H01L 21/683 (2006.01); H01L 21/02 (2006.01); H01L 21/66 (2006.01)
CPC H01L 21/6838 (2013.01) [H01L 21/02263 (2013.01); H01L 22/12 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing apparatus comprising:
a stage having a mounting region for a wafer on an upper surface;
a plurality of sucking pipes extending from the mounting region to a back surface side of the stage through the stage;
a vacuum pump that is connected to the plurality of sucking pipes and sucks the wafer onto the mounting region via the plurality of sucking pipes;
a cup provided on the upper surface of the stage and covering the wafer;
a gas supply line that pressurizes a space surrounded by the upper surface of the stage and the cup; and
a pressure sensor that detects pressure in the plurality of sucking pipes.