US 12,224,196 B2
Semiconductor manufacturing apparatus, method of reading position of carrier, and method of attaching semiconductor die on carrier using semiconductor manufacturing apparatus
Chan Ho Shin, Icheon-si (KR); Min Kyung Kim, Icheon-si (KR); and Soo Ho Jeon, Icheon-si (KR)
Assigned to SK hynix Inc., Icheon-si (KR)
Filed by SK hynix Inc., Icheon-si (KR)
Filed on Jul. 13, 2021, as Appl. No. 17/374,737.
Claims priority of application No. 10-2020-0170699 (KR), filed on Dec. 8, 2020.
Prior Publication US 2022/0181181 A1, Jun. 9, 2022
Int. Cl. B32B 41/00 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01); H01L 23/00 (2006.01)
CPC H01L 21/681 (2013.01) [H01L 21/687 (2013.01); H01L 24/74 (2013.01); H01L 24/80 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing apparatus comprising:
a chuck configured to receive a carrier thereon, the chuck including a chuck reference key that is positioned at an edge portion thereof;
a carrier contact device, including a contact position recognition key, configured to contact the carrier on the chuck;
a bonding head configured to transfer a semiconductor die to the carrier and configured to attach the semiconductor die on the carrier; and
a camera configured to obtain images of the chuck reference key and the contact position recognition key,
wherein the carrier contact device includes:
a plurality of push bars spaced apart from the chuck, capable of moving toward a center of the chuck on a plane that is parallel to the upper surface of the chuck; and
the contact location recognition keys disposed on each of the plurality of push bars.