US 12,224,194 B2
Substrate processing system and method for controlling substrate processing system
Atsushi Kubo, Tokyo (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Appl. No. 17/595,631
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed May 25, 2020, PCT No. PCT/JP2020/020622
§ 371(c)(1), (2) Date Nov. 19, 2021,
PCT Pub. No. WO2020/241599, PCT Pub. Date Dec. 3, 2020.
Claims priority of application No. 2019-099729 (JP), filed on May 28, 2019.
Prior Publication US 2022/0230904 A1, Jul. 21, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/68 (2013.01) [H01L 21/67178 (2013.01); H01L 21/6719 (2013.01); H01L 21/67196 (2013.01); H01L 21/67201 (2013.01); H01L 21/67259 (2013.01); H01L 21/6838 (2013.01); H01L 21/67167 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A substrate processing system comprising:
a process chamber in which a plurality of substrates is processed;
a vacuum transfer chamber connected to the process chamber;
a transfer device provided in the vacuum transfer chamber and configured to simultaneously transfer a plurality of substrates;
a module connected to the vacuum transfer chamber and having a plurality of stages on which substrates are placed;
a sensor configured to detect, while the transfer device transfers processed substrates from the process chamber to the module, an elongation amount of an arm of the transfer device, which is a thermally elongated amount of the arm due to heat in the process chamber; and
a controller,
wherein the controller is configured to correct positions of the stages in the module based on the elongation amount detected by the sensor.