US 12,224,193 B2
Control method and substrate transfer system
Takehiro Shindo, Yamanashi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Sep. 14, 2021, as Appl. No. 17/474,644.
Claims priority of application No. 2020-156679 (JP), filed on Sep. 17, 2020.
Prior Publication US 2022/0084862 A1, Mar. 17, 2022
Int. Cl. H01L 21/677 (2006.01); B25J 9/16 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01)
CPC H01L 21/67742 (2013.01) [B25J 9/1694 (2013.01); H01L 21/67259 (2013.01); H01L 21/67766 (2013.01); H01L 21/68 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A control method of a transfer mechanism for transferring a substrate and having a holder for holding the substrate, comprising:
detecting an outer edge of the substrate transferred by the transfer mechanism and measuring a center position of the substrate using a preset adjustment value corresponding to a path for transferring the substrate;
correcting a target position based on an amount of displacement between the center position of the substrate and a reference position of the holder; and
controlling the transfer mechanism such that the reference position of the holder becomes the corrected target position,
wherein the measuring of the center position of the substrate is performed by:
acquiring a position information of the sensor with respect to the transfer mechanism as a calibration data in a state where the substrate is held by the holder such that the reference position of the holder and the center position of the substrate coincide with each other;
storing the calibration data for each transfer path as the preset adjustment value; and
calculating the center position of the substrate using the preset adjustment value corresponding to the path for transferring the substrate.