	US 12,224,184 B2
	Methods for registration of circuit dies and electrical interconnects
Ankit Mahajan, Cupertino, CA (US); Saagar A. Shah, Minneapolis, MN (US); Mikhail L. Pekurovsky, Bloomington, MN (US); Kayla C. Niccum, Maplewood, MN (US); Kara A. Meyers, Oakdale, MN (US); Matthew R. D. Smith, Woodbury, MN (US); Gino L. Pitera, St. Paul, MN (US); Graham M. Clarke, Woodbury, MN (US); Jeremy K. Larsen, Farmington, MN (US); and Teresa M. Goeddel, St. Paul, MN (US)
Assigned to 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
Filed by 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
Filed on May 1, 2024, as Appl. No. 18/652,529.
Application 18/652,529 is a division of application No. 17/594,346, granted, now 12,020,951, previously published as PCT/IB2020/053517, filed on Apr. 14, 2020.
Claims priority of provisional application 62/840,072, filed on Apr. 29, 2019.
Prior Publication US 2024/0282592 A1, Aug. 22, 2024
Int. Cl. H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)

CPC H01L 21/56 (2013.01) [H01L 23/293 (2013.01); H01L 23/3107 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/03312 (2013.01); H01L 2224/0332 (2013.01); H01L 2224/03505 (2013.01); H01L 2224/03515 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05567 (2013.01)]

5 Claims

1. An article comprising:

microstructures extending upward from a major surface of a pliable mold, wherein the microstructures comprise a pliable mating surface;

a solid circuit die comprising a plurality of electrically conductive contact pads, wherein at least a portion of the contact pads directly contact the pliable mating surfaces of the microstructures; and

a polymeric carrier releasably attached to the major surface of the pliable mold, wherein the polymeric carrier at least partially encapsulates the solid circuit die, and wherein the polymeric carrier comprises channels corresponding to the microstructures wherein the channels are interconnected to at least a portion of the contact pads on the solid circuit die.