US 12,224,181 B2
Laser-cut lead-frame for integrated circuit (IC) packages
Tiange Xie, Si Chuan (CN); Li Xiang Zheng, Si Chuan (CN); Alex Chin Sern Ting, Johor (MY); and Zhenzhen He, Si Chuan (CN)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Aug. 27, 2021, as Appl. No. 17/458,653.
Prior Publication US 2023/0063278 A1, Mar. 2, 2023
Int. Cl. H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01)
CPC H01L 21/4842 (2013.01) [H01L 23/49541 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/80001 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for fabricating integrated circuit (IC) packages, the method comprising:
fabricating a plurality of IC dies;
providing a conductive metal material sheet;
laser-cutting the conductive metal material sheet to form a lead-frame sheet, the lead-frame sheet comprising at least one of through-holes and three-dimensional locking features;
coupling the IC dies to the lead-frame sheet; and
coupling the lead-frame sheet and the IC dies to packaging material to form an IC package block comprising the IC packages.