US 12,224,180 B2
Semiconductor device and a method of manufacturing a semiconductor device
Ricardo Yandoc, Nijmegen (NL); Anthony Matthew, Nijmegen (NL); Manoj Balakrishnan, Nijmegen (NL); and Adam Brown, Nijmegen (NL)
Assigned to Nexperia B.V., Nijmegen (NL)
Filed by NEXPERIA B.V., Nijmegen (NL)
Filed on Nov. 4, 2021, as Appl. No. 17/518,862.
Claims priority of application No. 20205690 (EP), filed on Nov. 4, 2020.
Prior Publication US 2022/0139724 A1, May 5, 2022
Int. Cl. H01L 21/48 (2006.01); B23K 20/10 (2006.01); B23K 101/40 (2006.01); H01L 21/60 (2006.01)
CPC H01L 21/4821 (2013.01) [B23K 20/10 (2013.01); B23K 2101/40 (2018.08); H01L 2021/60007 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a clip, wherein the clip comprises a clip slot; and
a slug, wherein the slug comprises a groove on an underside of the slug that is encased by the top of the slug,
wherein the groove and the clip slot are at least partially overlapping to form a gas pathway tunnel on the underside of the slug to an outside side of the slug.