US 12,224,173 B2
Polycrystalline ceramic substrate and method of manufacture
Vladimir Odnoblyudov, Danville, CA (US); Cem Basceri, Los Gatos, CA (US); and Shari Farrens, Boise, ID (US)
Assigned to Qromis, Inc., Santa Clara, CA (US)
Filed by Qromis, Inc., Santa Clara, CA (US)
Filed on Nov. 4, 2021, as Appl. No. 17/518,894.
Application 17/518,894 is a continuation of application No. 17/185,223, filed on Feb. 25, 2021.
Application 17/185,223 is a continuation of application No. 16/773,415, filed on Jan. 27, 2020, granted, now 10,964,535, issued on Mar. 30, 2021.
Application 16/773,415 is a continuation of application No. 16/161,853, filed on Oct. 16, 2018, granted, now 10,566,190, issued on Feb. 18, 2020.
Application 16/161,853 is a continuation of application No. 15/621,235, filed on Jun. 13, 2017, granted, now 10,134,589, issued on Nov. 20, 2018.
Claims priority of provisional application 62/354,623, filed on Jun. 24, 2016.
Prior Publication US 2022/0059341 A1, Feb. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/02 (2006.01); C23C 16/40 (2006.01); C23C 16/50 (2006.01); C23C 16/56 (2006.01); C30B 29/06 (2006.01); C30B 29/40 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 33/00 (2010.01); H01L 33/02 (2010.01)
CPC H01L 21/0242 (2013.01) [C23C 16/401 (2013.01); C23C 16/50 (2013.01); C23C 16/56 (2013.01); C30B 29/06 (2013.01); C30B 29/406 (2013.01); H01L 21/0243 (2013.01); H01L 21/0245 (2013.01); H01L 21/02516 (2013.01); H01L 21/02532 (2013.01); H01L 21/0254 (2013.01); H01L 21/84 (2013.01); H01L 27/12 (2013.01); H01L 33/0075 (2013.01); H01L 33/02 (2013.01); C30B 29/403 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An engineered substrate structure comprising:
a ceramic substrate having a front surface characterized by a plurality of peaks, the ceramic substrate comprising a polycrystalline material;
a planarization layer comprising a planarization layer material and coupled to the front surface of the ceramic substrate, the planarization layer defining fill regions filled with the planarization layer material between adjacent peaks of the plurality of peaks on the front surface of the ceramic substrate;
a barrier shell encapsulating the ceramic substrate and the planarization layer, wherein the barrier shell has a front side and a back side;
a bonding layer coupled to the front side of the barrier shell;
a single crystal layer coupled to the bonding layer; and
an electrically conductive layer coupled to the back side of the barrier shell.