US 12,224,164 B2
Radio frequency (RF) system with embedded RF signal pickups
Chelsea Dubose, Austin, TX (US); Barton Lane, Austin, TX (US); Merritt Funk, Austin, TX (US); Justin Moses, Austin, TX (US); and Yohei Yamazawa, Miyagi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Oct. 29, 2021, as Appl. No. 17/514,815.
Prior Publication US 2023/0132660 A1, May 4, 2023
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32935 (2013.01) [H01J 37/321 (2013.01); H01J 37/32174 (2013.01); H01J 37/3211 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A radio frequency (RF) system comprising:
a first RF device having a first outer wall;
a first conductive covering surface, a portion of the first conductive covering surface comprising a portion of the first outer wall;
a second RF device having a second outer wall, the first RF device being electrically coupled to the second RF device;
a second conductive covering surface, a portion of the second conductive covering surface comprising a portion of the second outer wall;
an insulating hole for an RF center conductor extending through the first conductive covering surface and the second conductive covering surface;
a cavity disposed between the first conductive covering surface and the second conductive covering surface, the cavity being an insulating region; and
an RF signal pickup disposed in the cavity.