US 12,224,161 B2
Low temperature manifold assembly for substrate processing systems
Gabriel De Jesus Soto, San Jose, CA (US)
Assigned to Lam Research Corporation, Fremont, CA (US)
Appl. No. 18/013,699
Filed by LAM RESEARCH CORPORATION, Fremont, CA (US)
PCT Filed May 5, 2022, PCT No. PCT/US2022/027757
§ 371(c)(1), (2) Date Dec. 29, 2022,
PCT Pub. No. WO2022/245545, PCT Pub. Date Nov. 24, 2022.
Claims priority of provisional application 63/190,493, filed on May 19, 2021.
Prior Publication US 2023/0352276 A1, Nov. 2, 2023
Int. Cl. H01J 37/32 (2006.01); C23C 16/46 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01J 37/32522 (2013.01) [C23C 16/463 (2013.01); H01J 37/32724 (2013.01); H01J 37/32889 (2013.01); H01L 21/67069 (2013.01); H01L 21/67103 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01J 2237/002 (2013.01); H01J 2237/2001 (2013.01); H01J 2237/334 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A manifold assembly for a processing chamber in a substrate processing system, the manifold assembly comprising:
a manifold including
a first valve assembly configured to flow a liquid coolant at a first temperature from a first channel of a coolant assembly to the processing chamber, wherein the first valve assembly is configured to flow the liquid coolant at a cryogenic temperature;
a first weldment block including tubing associated with the first valve assembly,
a second valve assembly configured to flow the liquid coolant at a second temperature from a second channel of the coolant assembly to the processing chamber, wherein the second temperature is greater than the first temperature, and
a second weldment block including tubing associated with the second valve assembly; and
an insulative housing enclosing the first valve assembly, the first weldment block, and the second weldment block,
wherein the insulative housing is comprised of a plurality of layers of an insulative material.