| CPC H01H 85/046 (2013.01) [H01H 85/06 (2013.01); H05K 1/181 (2013.01); H05K 1/188 (2013.01)] | 23 Claims |

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1. An embedded substrate, comprising an insulation layer, an electronic element, and a conductive connector,
wherein the electronic element and the conductive connector are embedded inside the insulation layer, the conductive connector is electrically connected to the electronic element, and the conductive connector comprises an external connection end for transmitting an electrical signal to the electronic element; and
the conductive connector comprises at least one fuse unit, each of the at least one fuse unit comprises a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a current threshold, to disconnect an electrical connection between the electronic element and the external connection end,
wherein the insulation layer comprises a first insulation layer and a second insulation layer that are disposed in a stacked manner, and the second insulation layer comprises a hollow area; and the electronic element and the conductive connector are embedded in the first insulation layer, the at least one fuse unit is located on a surface, of the first insulation layer, that faces the second insulation layer, and the at least one fuse unit is exposed in the hollow area.
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