US 12,224,128 B2
Multilayer electronic component
Hyo Sung Choi, Suwon-si (KR); Jung Jin Park, Suwon-si (KR); Ho Sam Choi, Suwon-si (KR); Jae Won Kim, Suwon-si (KR); Sun Mi Kim, Suwon-si (KR); and Jong Ho Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 26, 2023, as Appl. No. 18/139,444.
Claims priority of application No. 10-2022-0188486 (KR), filed on Dec. 29, 2022.
Prior Publication US 2024/0234034 A1, Jul. 11, 2024
Int. Cl. H01G 4/30 (2006.01); C04B 35/64 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01)
CPC H01G 4/30 (2013.01) [C04B 35/64 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/224 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including:
a capacitance formation portion including a dielectric layer and an internal electrode, alternately disposed in a first direction, and
a cover portion disposed on both end surfaces of the capacitance formation portion opposing each other in the first direction; and
an external electrode disposed outside the body and connected to the internal electrode,
wherein the cover portion includes fluorine (F), and
A1 and A2 satisfy A2>A1, where A1 is an average size of a dielectric grain included in the cover portion, and A2 is an average size of a dielectric grain included in the dielectric layer.