| CPC H01G 4/2325 (2013.01) [H01G 4/30 (2013.01)] | 21 Claims |
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1. A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode disposed on the third surface of the body; and
a second external electrode disposed on the fourth surface of the body,
wherein one of the first and second external electrodes includes a first electrode layer disposed on one of the third and fourth surfaces and including a conductive material, a second electrode layer disposed on the first electrode layer and including Ni and glass, a third electrode layer disposed on the second electrode layer and including an Ni—Sn alloy, and a conductive resin layer disposed on the third electrode layer and including a conductive metal and a resin,
wherein E1>E2 in which E1 is a standard reduction potential of the first electrode layer and E2 is a standard reduction potential of the second electrode layer.
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