US 12,224,124 B2
Multilayer electronic component
Young Joon Oh, Suwon-si (KR); and Jeong Ryeol Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 5, 2023, as Appl. No. 18/131,032.
Claims priority of application No. 10-2022-0174726 (KR), filed on Dec. 14, 2022.
Prior Publication US 2024/0203650 A1, Jun. 20, 2024
Int. Cl. H01G 4/12 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/1227 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a first dielectric layer and internal electrodes alternately disposed with the first dielectric layer interposed therebetween in a first direction, the body comprising first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and
external electrodes disposed on the third and fourth surfaces,
wherein:
the internal electrodes include:
body portions alternately disposed with the first dielectric layer in the first direction to form capacitance, and
end portions extending from the body portions in the second direction, and
a region including the first dielectric layer and the body portions in the body is a capacitance forming portion,
regions disposed on one surface and the other surface of the capacitance forming portion in the second direction and including the end portions of the internal electrodes are first margin portions, and
at least one of the first margin portions includes a second dielectric layer including Ta4AlC3, and the second dielectric layer is disposed between the end portions of the internal electrodes.