US 12,224,121 B2
Multilayer capacitor and board having the same mounted thereon
A Ra Cho, Suwon-si (KR); Dong Hwi Shin, Suwon-si (KR); and Seon Young Yoo, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 9, 2023, as Appl. No. 18/232,050.
Application 18/232,050 is a continuation of application No. 17/356,110, filed on Jun. 23, 2021, granted, now 11,763,987.
Claims priority of application No. 10-2020-0187162 (KR), filed on Dec. 30, 2020.
Prior Publication US 2023/0386742 A1, Nov. 30, 2023
Int. Cl. H01G 4/008 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H01G 4/008 (2013.01) [H01G 4/232 (2013.01); H01G 4/30 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A multilayer capacitor comprising:
a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween; and
an external electrode disposed on the capacitor body to be connected to the plurality of internal electrodes,
wherein at least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected,
the capacitor body comprises first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, perpendicular to the first direction, and fifth and sixth surfaces opposing each other in a third direction, perpendicular to the first and second directions,
in the third and fourth surfaces of capacitor body, a plurality of grooves are disposed between the dielectric layers disposed in the first direction,
the at least one intermetallic compound layer is disposed in the grooves, and
the external electrode is free of an intermetallic compound layer.