US 12,224,119 B2
Electronic component
Satoshi Yokomizo, Nagaokakyo (JP); Shinobu Chikuma, Nagaokakyo (JP); and Yohei Mukobata, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Dec. 29, 2023, as Appl. No. 18/400,401.
Application 18/400,401 is a continuation of application No. 17/752,905, filed on May 25, 2022, granted, now 11,881,353.
Claims priority of application No. 2021-091541 (JP), filed on May 31, 2021.
Prior Publication US 2024/0136122 A1, Apr. 25, 2024
Prior Publication US 2024/0234029 A9, Jul. 11, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 2/06 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01); H01G 4/248 (2006.01)
CPC H01G 2/06 (2013.01) [H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01G 4/008 (2013.01); H01G 4/1227 (2013.01); H01G 4/248 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An electronic component comprising:
an electronic element; and
an interposer board; wherein
the electronic element includes:
a multilayer body including dielectric layers and internal electrode layers which are alternately laminated, a pair of multilayer body end surfaces orthogonal or substantially orthogonal to the internal electrode layers, a pair of multilayer body side surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces, and a pair of multilayer body main surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces and the multilayer body side surfaces; and
external electrodes each on a respective one of the pair of multilayer body end surfaces of the multilayer body and connected to the internal electrode layers;
the interposer board includes a pair of board end surfaces, a pair of board side surfaces orthogonal or substantially orthogonal to the board end surfaces, and a pair of board main surfaces orthogonal or substantially orthogonal to the board end surfaces and the board side surfaces;
one of the pair of board main surfaces is joined with one of the pair of multilayer body main surfaces or one of the pair of multilayer body side surfaces;
the external electrodes include a first Cu layer and a first Ni plated layer;
a second Cu layer is located on the interposer;
a second Ni plated layer is located on the second Cu layer;
the interposer board is an alumina board;
the first Ni plated layer is spaced from the second Ni plated layer; and
a first Sn plated layer is located on the first Ni plated layer and the second Ni plated layer.