US 12,224,103 B2
Angled inductor with small form factor
Brandon Marin, Gilbert, AZ (US); Jeremy Ecton, Gilbert, AZ (US); Suddhasattwa Nad, Chandler, AZ (US); Matthew Tingey, Mesa, AZ (US); Ravindranath Mahajan, Chandler, AZ (US); and Srinivas Pietambaram, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 15, 2021, as Appl. No. 17/348,580.
Prior Publication US 2022/0399150 A1, Dec. 15, 2022
Int. Cl. H05K 1/02 (2006.01); G11B 5/17 (2006.01); H01F 17/02 (2006.01); H01F 27/23 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01L 21/822 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01); H01L 25/18 (2023.01); H01L 27/01 (2006.01); H01L 27/04 (2006.01); H01L 27/32 (2006.01); H05K 3/28 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 27/324 (2013.01); H01L 23/49838 (2013.01); H01L 25/18 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a first metal pad embedded in a dielectric material;
a second metal pad embedded in the dielectric material and spaced less than one tenth millimeter from the first metal pad, wherein a surface of the first metal pad is substantially co-planar with a surface of the second metal pad; and
a first metal trace embedded in the dielectric material and attached between the first and second metal pads, wherein a first surface of the first metal trace is non-co-planar with the co-planar surfaces of the first and second metal pads at a maximum height of less than one millimeter from the co-planar surfaces of the first and second metal pads, and wherein a second surface of the first metal trace is angled at a non-perpendicular angle and a non-parallel angle relative to the co-planar surfaces of the first and second metal pads.