US 12,224,101 B2
Inductor device
Hsiao-Tsung Yen, Hsinchu (TW); and Ka-Un Chan, Hsinchu (TW)
Assigned to REALTEK SEMICONDUCTOR CORPORATION, Hsinchu (TW)
Filed by Realtek Semiconductor Corporation, Hsinchu (TW)
Filed on Mar. 29, 2021, as Appl. No. 17/215,321.
Claims priority of application No. 109110870 (TW), filed on Mar. 30, 2020.
Prior Publication US 2021/0304953 A1, Sep. 30, 2021
Int. Cl. H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 17/0013 (2013.01); H01F 27/2828 (2013.01); H01F 27/29 (2013.01); H01F 2017/004 (2013.01); H01F 2017/0073 (2013.01); H01F 2027/2809 (2013.01); H01F 2027/2819 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A inductor device, comprising:
a first wire, comprising:
a plurality of first sub-wires;
a second wire, comprising:
a plurality of second sub-wires, wherein an arranged sequence of the first sub-wires and the second sub-wires comprises one of at least two first sub-wire of the first sub-wires, another one of at least two first sub-wire of the first sub-wires, and at least one of second sub-wire of the second sub-wires; and
a third wire, disposed adjacent to the at least two first sub-wire of the first sub-wires, wherein the third wire partially overlaps at least two of the first sub-wires.