US 12,224,089 B2
Thin film resistor
Chuan Wang, Singapore (SG); Chim Seng Seet, Singapore (SG); and Yudi Setiawan, Singapore (SG)
Assigned to GLOBALFOUNDRIES Singapore Pte. Ltd., Singapore (SG)
Filed by GLOBALFOUNDRIES Singapore Pte. Ltd., Singapore (SG)
Filed on Apr. 8, 2022, as Appl. No. 17/716,276.
Prior Publication US 2023/0326634 A1, Oct. 12, 2023
Int. Cl. H01C 7/00 (2006.01); H01C 17/08 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01)
CPC H01C 7/006 (2013.01) [H01C 17/08 (2013.01); H01L 21/76802 (2013.01); H01L 23/5228 (2013.01); H01L 23/5283 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A structure comprising:
a thin film resistor comprising an opening and being between an upper insulator material and a lower insulator material; and
a contact extending through the opening in the thin film resistor and into the lower insulator material, wherein a sidewall of the contact physically contacts ends of the thin film resistor within the opening.