US 12,224,081 B2
Conductive paste and electronic device
Zhongwei Ren, Beijing (CN); and Jiameng Kang, Beijing (CN)
Assigned to Beijing Dream Ink Technologies Co., Ltd., Beijing (CN)
Appl. No. 17/790,468
Filed by Beijing Dream Ink Technologies Co., Ltd., Beijing (CN)
PCT Filed Nov. 23, 2021, PCT No. PCT/CN2021/132383
§ 371(c)(1), (2) Date Jun. 30, 2022,
PCT Pub. No. WO2022/183783, PCT Pub. Date Sep. 9, 2022.
Claims priority of application No. 202110240550.0 (CN), filed on Mar. 4, 2021.
Prior Publication US 2023/0170108 A1, Jun. 1, 2023
Int. Cl. H01B 1/22 (2006.01); C08K 3/08 (2006.01); C08L 63/00 (2006.01); C08L 75/08 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H05K 3/34 (2006.01)
CPC H01B 1/22 (2013.01) [C08K 3/08 (2013.01); C08L 63/00 (2013.01); C08L 75/08 (2013.01); H05K 1/092 (2013.01); H05K 3/1283 (2013.01); H05K 3/34 (2013.01); C08K 2003/0806 (2013.01); H05K 2201/032 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A conductive paste, comprising: a base resin, a solvent, a conductive filler, a curing agent, and an auxiliary agent,
wherein the base resin is a mixture of epoxy resin and polyurethane, a weight percentage of the epoxy resin in the base resin is greater than or equal to 50%, and the epoxy resin limits the polyurethane in a structure formed by curing of the base resin
wherein the conductive paste further comprises a low-molecular weight polyol,
wherein the curing agent is blocked polyisocyanate, and the polyurethane, the low-molecular weight polyol, and the blocked polyisocyanate are reacted during a heat curing process to form a flexible three-dimensional net structure; and
wherein the conductive paste comprises 3 wt % to 15 wt % of the base resin, 5 wt % to 20 wt % of the solvent, 60 wt % to 85 wt % of the conductive filler, 3 wt % to 15 wt % of the low-molecular weight polyol, 3 wt % to 10 wt % of the blocked polyisocyanate, and 0.2 wt % to 10 wt % of the auxiliary agent.