US 12,223,870 B2
Screen module, display assembly, and electronic device
Yan Lv, Shenzhen (CN); Bin Yan, Shenzhen (CN); Guotong Zhou, Shenzhen (CN); and Dong Ma, Shenzhen (CN)
Assigned to HONOR DEVICE CO., LTD., Shenzhen (CN)
Appl. No. 17/790,347
Filed by Honor Device Co., Ltd., Shenzhen (CN)
PCT Filed Feb. 10, 2022, PCT No. PCT/CN2022/075894
§ 371(c)(1), (2) Date Jun. 30, 2022,
PCT Pub. No. WO2022/183893, PCT Pub. Date Sep. 9, 2022.
Claims priority of application No. 202120461785.8 (CN), filed on Mar. 3, 2021; and application No. 202120970530.4 (CN), filed on May 8, 2021.
Prior Publication US 2024/0177641 A1, May 30, 2024
Int. Cl. G09G 3/00 (2006.01); B32B 3/26 (2006.01); B32B 7/05 (2019.01); G09F 9/30 (2006.01); B32B 17/06 (2006.01); G02F 1/1333 (2006.01); H05K 1/14 (2006.01)
CPC G09G 3/035 (2020.08) [B32B 3/263 (2013.01); B32B 7/05 (2019.01); G09F 9/301 (2013.01); B32B 17/06 (2013.01); B32B 2255/28 (2013.01); B32B 2307/42 (2013.01); B32B 2307/546 (2013.01); G02F 1/133305 (2013.01); H05K 1/147 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A screen module, comprising:
a single display panel bent to form a first panel layer and a second panel layer, wherein the first panel layer is spaced apart from the second panel layer, and wherein the first panel layer and the second panel layer are connected by a bent region;
a support layer located between the first panel layer and the second panel layer, wherein a thickness of the support layer close to the bent region is greater than a thickness of a first region of the support layer; and
a display driver chip located on a side of the second panel layer away from the first panel layer,
wherein a projection of the first region of the support layer on the first panel layer overlaps with a projection of the display driver chip on the first panel layer.