CPC G08B 6/00 (2013.01) [G02B 7/08 (2013.01); G03B 5/00 (2013.01); G03B 9/40 (2013.01); G03B 13/36 (2013.01); H02K 11/21 (2016.01); H02K 41/0354 (2013.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01); H05K 1/181 (2013.01); H05K 2201/10916 (2013.01)] | 19 Claims |
1. A haptic feedback system, configured to be disposed on a device, and comprising:
a fixed portion fixedly connected to the device;
a movable portion movable relative to the fixed portion;
a driving assembly configured to drive the movable portion to move relative to the fixed portion for generating feedback to the device; and
a first connecting assembly, wherein the movable portion is movably connected to the fixed portion via the first connecting assembly, so that the movable portion has a first vibration mode relative to the fixed portion,
wherein the driving assembly receives a first signal having a first frequency, and the first frequency is the same as a frequency of the first vibration mode,
wherein the movable portion further comprises a mode adjustment assembly for making the movable portion enter a second vibration mode relative to the fixed portion, the frequency of the first vibration mode is different from a frequency of the second vibration mode, and the mode adjustment assembly comprises:
a frame connecting the first connecting assembly;
an adjustment element movable relative to the frame, wherein the adjustment element is movable relative to the fixed portion; and
a second connecting assembly, wherein the adjustment element is movably connected to the frame via the second connecting assembly,
wherein mass of the adjustment element is different from mass of the frame.
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