| CPC G02B 6/1228 (2013.01) [G02B 6/12004 (2013.01); G02B 6/136 (2013.01); H01S 5/026 (2013.01); G02B 6/12002 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12078 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12142 (2013.01); G02B 2006/12147 (2013.01)] | 11 Claims |

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1. A photonic chip comprising:
a substrate which mainly extends in a plane called “plane of the substrate”,
a first waveguide which mainly extends parallel to the plane of the substrate and whose core is made of a III-V material,
a second waveguide which mainly extends parallel to the plane of the substrate and whose core is made of silicon,
an optical coupler capable of transferring, between a start and an end of a coupling region, at least a part of an optical signal which is propagating, at the start of the coupling region, in one of the first and second waveguides towards the other of the first and second waveguides, said optical coupler comprising for said purpose:
a first extension made of III-V material which extends the core of the first waveguide into the coupling region,
a second extension made of silicon which extends the core of the second waveguide into the coupling region, said second extension runs facing the first extension,
wherein the optical coupler comprises a SiGe inclusion buried inside of the second extension, said inclusion:
being made of SiGe whose chemical formula is Si1−xGex, where x is in the range between 0.2 and 0.5, and
being optically coupled, on a first side, to the first waveguide and, on a second opposing side, to the second waveguide.
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