| CPC G01R 31/311 (2013.01) [G01R 31/2837 (2013.01)] | 14 Claims |

|
1. A semiconductor device inspection method, comprising:
supplying power to a semiconductor device and measuring electrical characteristics of the semiconductor device according to the supply of the power;
scanning the semiconductor device with light intensity-modulated with a first frequency and light intensity-modulated with a second frequency higher than the first frequency and acquiring a characteristic signal indicating the electrical characteristics of the first frequency component and the second frequency component according to the scanning;
calculating a frequency of the characteristic signal at which the characteristic signal at a first scanning position reflecting the electrical characteristics of a first position in an optical axis direction of the light in the semiconductor device and the characteristic signal at a second scanning position reflecting the electrical characteristics of a second position in the optical axis direction of the light in the semiconductor device have a predetermined phase difference;
correcting a phase component of the characteristic signal at an arbitrary scanning position with a phase component of the characteristic signal at the first scanning position in the semiconductor device as a reference; and
acquiring the characteristic signal at the arbitrary scanning position at the calculated frequency and outputting an in-phase component and a quadrature component of the characteristic signal.
|