US 12,222,322 B2
System and method for the acoustic detection of cracks in a semiconductor substrate
Oliver Nagler, Munich (DE); and Marianne Unterreitmeier, Woerth (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Aug. 13, 2021, as Appl. No. 17/401,380.
Claims priority of application No. 10 2020 121 427.8 (DE), filed on Aug. 14, 2020.
Prior Publication US 2022/0050083 A1, Feb. 17, 2022
Int. Cl. G01N 29/04 (2006.01); H01L 21/66 (2006.01); G01N 29/12 (2006.01)
CPC G01N 29/045 (2013.01) [H01L 22/12 (2013.01); G01N 29/12 (2013.01); G01N 2291/014 (2013.01); G01N 2291/023 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A system for the acoustic detection of cracks in a semiconductor substrate, the system comprising:
a force generating unit configured to press down onto a semiconductor substrate and thereby apply a force onto the semiconductor substrate;
a detector unit separate from the force generating unit and comprising a resonating indenter and an acoustic emission sensor coupled to the resonating indenter; and
an evaluation unit configured to evaluate acoustic signals detected by the detector unit and configured to determine, whether a crack has occurred based on the detected signals,
wherein the resonating indenter is configured to contact the semiconductor substrate at a lateral distance from the force generating unit, and
wherein the force generating unit and the resonating indenter are configured to contact the semiconductor substrate on the same side.