US 12,222,222 B2
Sensor cover and sensor module
Kazuya Takemoto, Tokyo (JP); Atsushi Koyanagi, Tokyo (JP); and Naoto Tatsuoka, Tokyo (JP)
Assigned to AGC Inc., Tokyo (JP)
Filed by AGC Inc., Tokyo (JP)
Filed on Apr. 3, 2024, as Appl. No. 18/625,325.
Application 18/625,325 is a continuation of application No. PCT/JP2022/038327, filed on Oct. 14, 2022.
Claims priority of application No. 2021-173364 (JP), filed on Oct. 22, 2021.
Prior Publication US 2024/0263974 A1, Aug. 8, 2024
Int. Cl. G01D 11/24 (2006.01); G02B 5/28 (2006.01); H05B 3/16 (2006.01)
CPC G01D 11/245 (2013.01) [G02B 5/281 (2013.01); H05B 3/16 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A sensor cover positioned in an opening of a housing that houses a sensor, the sensor cover comprising:
a conductor;
a dielectric multilayer film; and
a heating film, the conductor, the dielectric multilayer film, and the heating film being positioned in a predetermined order from an outside of the housing toward an inside of the housing,
wherein the conductor is a substrate which comprises a conductive material and has a thickness of 0.1 mm or more,
the conductor and the heating film are insulated from each other,
the conductor is electrically connected to a ground, and
a shortest distance between the conductor and the heating film is 2.0 μm or more.