US 12,222,201 B2
Method for measuring surface parameter of copper foil, method for sorting copper foil, and method for producing surface-treated copper foil
Hiroaki Kurihara, Ageo (JP); and Takeshi Iwase, Ageo (JP)
Assigned to MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
Appl. No. 18/714,941
Filed by MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
PCT Filed Dec. 22, 2021, PCT No. PCT/JP2021/047646
§ 371(c)(1), (2) Date May 30, 2024,
PCT Pub. No. WO2023/119513, PCT Pub. Date Jun. 29, 2023.
Prior Publication US 2024/0328779 A1, Oct. 3, 2024
Int. Cl. G01B 11/30 (2006.01); G01B 9/04 (2006.01); H05K 1/02 (2006.01)
CPC G01B 11/30 (2013.01) [G01B 9/04 (2013.01); H05K 1/0237 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for measuring a surface parameter of copper foil, comprising the steps of:
(a) acquiring a surface profile on at least one surface of an untreated copper foil;
(b) setting a cutoff value for an L filter based on the surface profile;
(c) acquiring a surface profile on at least one surface of a surface-treated copper foil originating from the untreated copper foil;
(d) subjecting the surface profile of the surface-treated copper foil to filter processing, the filter processing including processing using an L filter with the cutoff value; and
(e) calculating at least one of surface parameters defined by ISO 25178 on the surface of the surface-treated copper foil based on the surface profile after the filter processing.