US 12,222,159 B2
Apparatus and method for treating substrate
Do Hyeon Yoon, Cheonan-si (KR); Yong Hyun Choi, Suwon-si (KR); Eui Sang Lim, Cheonan-si (KR); and Jun Young Choi, Cheongju-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Aug. 23, 2021, as Appl. No. 17/408,953.
Claims priority of application No. 10-2020-0120329 (KR), filed on Sep. 18, 2020.
Prior Publication US 2022/0090859 A1, Mar. 24, 2022
Int. Cl. F26B 21/14 (2006.01); F26B 5/14 (2006.01); F26B 21/10 (2006.01)
CPC F26B 21/14 (2013.01) [F26B 5/14 (2013.01); F26B 21/10 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus for treating a substrate, the apparatus comprising:
a body having an inner space in which the substrate is dried by a drying fluid in a supercritical state;
a fluid supply unit configured to supply the drying fluid into the inner space;
a fluid exhaust unit configured to release the drying fluid from the inner space and including:
a main exhaust line connected with the body;
a plurality of branch lines connected to the main exhaust line,
wherein the plurality of branch lines includes a flow line;
a controller configured to control the fluid supply unit and the fluid exhaust unit to perform:
a pressure-raising step of raising pressure in the inner space to a set pressure; and
a flow step of generating a flow of the drying fluid in the inner space by releasing, by the fluid exhaust unit, the drying fluid from the inner space while the fluid supply unit supplies the drying fluid into the inner space; and
a pressure adjustment member installed at the flow line and configured to:
measure pressure of the drying fluid flowing through the main exhaust line; and
adjust the pressure in the inner space to the set pressure by adjusting an amount of the drying fluid released per unit time through the flow line.