US 12,221,715 B2
Microporous plating solution and method of using this plating solution to perform microporous plating on object to be plated
Kana Shibata, Kanagawa (JP)
Assigned to JCU CORPORATION, Taito-ku (JP)
Appl. No. 17/438,149
Filed by JCU CORPORATION, Taito-ku (JP)
PCT Filed Mar. 3, 2020, PCT No. PCT/JP2020/008897
§ 371(c)(1), (2) Date Sep. 10, 2021,
PCT Pub. No. WO2020/184289, PCT Pub. Date Sep. 17, 2020.
Claims priority of application No. 2019-044556 (JP), filed on Mar. 12, 2019.
Prior Publication US 2022/0213606 A1, Jul. 7, 2022
Int. Cl. C25D 3/12 (2006.01); C25D 3/06 (2006.01); C25D 5/00 (2006.01)
CPC C25D 3/12 (2013.01) [C25D 3/06 (2013.01); C25D 5/623 (2020.08)] 11 Claims
OG exemplary drawing
 
1. A microporous plating solution, comprising nonconductive particles, polyaluminum chloride having a basicity of from 50 to 65, and a base plating solution, wherein the base plating solution is a Watts bath comprising from 240 g/L to 320 g/L of nickel sulfate.